|
Equipment Reliability
Institute
ERI News - your reliability newsletter
November 2004 -
volume 17
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| Hello,
readers -
We intend each issue of this Newsletter to help
you with your problems. First: who among you is involved with the
cooling of electronics? That’s the area in which Joel
Newberger,
now affiliated with ERI, consults and teaches. You might want one
of his training classes (titles and brief description here) to
meet at your facility.
Second, Chuck
Wright writes about measurement uncertainty (he and
I both prefer to emphasize certainty) and how you can deal with
uncertainty requirements. You might want one of his training
classes to meet
at your facility.
Third is a contribution by myself, dealing with one of my favorite
subjects: the simultaneous exciting of multiple resonances. That’s
why we perform random vibration tests. You might want one of my
training
classes to meet at
your facility. My “open” classes (to which you can
come as an individual) are listed at both our Web pages and also
here, at this issue.
Fourth are some additional “Test
Lab Musings” by highly
experienced test engineer Bob Renz of G/D Bloomington, MN. I had
the pleasure of seeing Bob at the recent SAVIAC meeting. Comments
or questions for Bob? Click
here.
Best wishes,
Wayne Tustin |
| ******************************* |
| Cooling
Board Mounted Components
Utilizing “Planes” and “Bridges” or
Maybe
Passive Cooling of Printed Wiring Boards
by Joel Newberger
Thermally effective circuit board designs
utilize embedded copper ground “planes” and via(s)
(“bridges”) to minimize component thermal signatures.
Electrical vias are plated thru holes that
interconnect signal, power, and ground board circuitry to embedded
copper layers (planes). Sometimes, electrical vias behave as thermal
vias . . . but not always! Thermal vias are also plated through
holes, but are dedicated to conductively couple component heat
to the dip side ground plane thermally conditioned by heat sinking
to a chassis septum or flange(s). Copper layer(s) thickness range
from ½ to 2 ounce copper. Thermal vias traverse, or bridge,
the entire circuit board from component mounting surface to dip
side ground plane. Electrical vias, whose principle function is
electrical connectivity, do not necessarily traverse the entire
board. Electrical vias are generally less effective since in most
designs, they may not be coupled to the ground plane.
Unetched copper, at any layer on a circuit board, is useful since
unetched copper spreads component heat in transverse and lateral
directions . . . which is helpful
in minimizing thermal signatures. Therefore, leave as much copper as the electrical
design allows! Two-dimensional heat spreading takes place at every embedded copper
plane. Thermal vias must be the principal “bridge” from component
to circuit board embedded planes, especially, the dip side ground plane, in order
to minimize component thermal profiles. Sometimes, thermal design difficulties
may be eliminated if copper plane(s) thickness is increased.
At a board thickness of 1/16 of an inch, a 0.02 inch diameter
plated thru hole thermal impedance is characterized as follows:
| thru hole plated |
single hole |
copper thickness
(inches) |
thermal impedance
(C/W) |
| .001 |
110.4 |
| .00142 |
75.4 |
| .002 |
55.2 |
At 1/32 of an inch board thickness, via thermal impedance is one
half the impedance levels shown above.
As an example, consider an IC
dissipating 750 mw. If five thermal vias (.02”dia,
2 mil wall) are located below IC case foot print envelope, the effective
thermal coupling across the circuit board is 55.2C/W/5 vias =
11.04C/W. Therefore, temperature
rise across vias (board thickness) is .75 watts x 11.04 C/W = 8.28 C. With
ten vias, the temperature rise is reduced to 4.14 C. Coupling
heat from component
case to board surface can be accomplished either by soldering case to vias,
or utilizing easy to apply “filler” material (limited
to below 8 mils thick if a non thermal conductor is used). The “filler” is
used to bridge the void between component case and circuit board.
Circuit board materials are generally poor conductors of heat;
however, when viewed through the prism of “planes” and “bridges,” consisting
of embedded copper layers, (even when partially etched for circuitry) and smart
thermal via placement, it is transformed into a cost-effective conduction-cooled,
component mounting platform. This thermal design approach has been successfully
exploited in all types of applications ranging from indoor/outdoor telecommunications
equipment, industrial equipment, in-orbit space equipment, shipboard electronics,
and aircraft avionics.
Over 6,000 years ago, the Ancient Sumerians knew the value
of copper (they prized silver and gold too!). All three
materials are excellent thermal
conductors. Similar to the Ancient Sumerians, the circuit board designer
should develop
an
appreciation of the thermal benefits associated with embedded copper “planes.” Once
appreciated, use of thermal “bridges” will follow.
Joel is President
of Thermalogics, Inc., and a principal in SNA Engineering.
SNA specializes in mechanical
design/packaging and in thermo/structural analysis of electronic equipment
used in both commercial/industrial and military applications.
For a listing
of available short courses (listing of 15+ short course descriptions)
and more information about Joel, please visit his
page at ERI. Joel invites readers to "mix and match" these
courses and thus to identify electronics cooling training that
can in 2005 meet at their facilities.
(back to the top) |
| ******************************* |
| Measurements
Uncertainty?
I Prefer Measurement Certainty
by Charles "Chuck" Wright
I used to think I was the
only test measurements engineer that absolutely detested doing
uncertainty analyses on my measurement system designs and test
data. A legitimate uncertainty analysis can be a bookkeeping
nightmare – bias or precision? Precision or bias? Have
I got all the meaningful errors? How do I put it all together?
Where should I focus my attention?
More than 80 uncertainty sources for a simple
static surface strain measurement at room temperature have been
identified. Each would
have to be assessed in terms of bias and precision errors if a
valid and complete uncertainty analysis were required. That’s
more than 160 terms requiring investigation!
In teaching the Applied Measurements Engineering
Short Course all over the country for the last 14 years, I’ve discovered
that I am not alone. Most practicing measurements, instrumentation
or data acquisition engineers, in my classrooms at least, simply
do not do uncertainty analyses on their systems or their data.
Some do, most don’t.
How can this be? How can an engineer sell his test data to the
customer without defining the uncertainty in that data? An answer
of 2120 Gpk maximum in a shock test is meaningless without an uncertainty
statement and validation. Why would any smart structural dynamics
analyst, paying for that test by the way, accept such an unsubstantiated
answer? How can an engineer design a measurement system without
using allowable uncertainty as a design requirement? Does any experimental
mechanical engineering test laboratory have a legitimate written
process in place demanding uncertainty analysis and stating a method
for performing that analysis? Let me try to answer those questions
for you from my experience teaching measurements across the country.
Before you can validate your test data, the
experimental uncertainty must be known. Before you can acquire
the data, a measurement system
must be designed and implemented. You should have experimental
uncertainty requirements before you design. In the absence of this
knowledge, how do you know your measurement system will assure
the uncertainties you need to meet the customer’s requirements?
How many of us get uncertainty requirements with every test request
from the customer for the data? When I ask this question in my
courses, it’s usually followed by a roomful of silence. Even
today, few test people ever get uncertainty requirements from their
customers. Why is that?
The Customer’s Role
Here comes a crack analyst asking for an expensive test. All tests
are expensive because they can only occur late in the product
development cycle. You need hardware to test and the product
owner has already made a large investment just to create that
hardware. The test request defines the test conditions and the
data requirements. If the customer cannot tell you the uncertainty
requirement for every measured channel, then you should not run
the test. The test problem has not yet been thought through in
enough detail to justify the expenditure. The customer has to
tell you how close to the truth you have to come (allowable uncertainty),
or you can’t guarantee the validity of the data. If you
can’t guarantee the validity of the data, why run the test?
In the absence of the uncertainty allowable, in a rigorous world
you simply should not test.
Why can’t test professionals get the
needed information? A sensitivity analysis of the analytical
model and any data reduction
equations is required to define the allowable uncertainties in
test. Perhaps the analyst was not taught how to do it in college.
In this case, we blame the college engineering faculty. We need
to educate the educators. Perhaps there is not enough funding on
the program to do such an analysis. In this case, we need to educate
the program manager. More likely, we test professionals did not
demand the information from the customer and explain the reason
why we need it. Here, the blame falls closer to home.
You Need the Uncertainty Requirements to Design and Test
You need the uncertainty requirements. Make sure you get them early.
How do you get them? I only know of a single test laboratory
in this country that has a written process for how uncertainty
requirements are to be acquired from the customer. The process
also defines a method for evaluating the uncertainty numbers
and finishing the error propagation. The process owner told me
that sometimes getting the number is painful, but they get them.
I have some issues with how they deal with the numbers, but at
least they have a process written down. If there are other labs
that have written processes for doing this work, please let me
know so I can share the information.
Over the last twenty years or so, the major
argument in uncertainty analysis has been about what math to
use. This argument occurred
on the arcane playing field of statistics and partial differential
equations. This argument has largely been settled. A good place
to start is ISO’s Guide to the Expression of Uncertainty
in Measurement, affectionately referred to as the GUM. You
can find this at the NIST
website.
This international standard defines how to crunch the numbers.
The Real and Remaining Problem
The remaining and more important discussion is around what numbers
to put in the analysis. Almost all of the numbers I see in published
uncertainty analyses reflect only those available from the manufacturer’s
specifications for the hardware and calibration data. The analysis
shown below is my favorite, from an unnamed periodical’s
public website on uncertainty analysis.

What is missing here? Reality is missing here.
This analysis violates the most basic requirements of international
standards. But worse,
it clearly includes only data that was easy to get, as mentioned
above. It totally disregards the much larger errors that will
inevitably occur in the measurement due to environmental responses
throughout the entire measurement system and interface to the
phenomenon to be measured. The real system level uncertainty
is probably one to two orders of magnitude larger than shown
here. I assert that this analysis grossly understates the real
uncertainties at the system level. Most uncertainty analyses I see suffer from
the same illness. They include the 0.03% FS errors given by the
manufacturer and
metrology, while neglecting the 5, 10 and 20% FS or larger errors
that actually occur during the test. My course includes numerous
examples of this unfortunate engineering myopia. Perhaps the best
one is a temperature measurement in a rocket nozzle throat that
carried a traceable calibration of 1.5% FS, but read 2500F in error – an “accurate” measurement
of the wrong temperature! For a measurements professional interested
in a fruitful career, this is not a good thing to do.
In a three decade career in measurement engineering, my organization
only guaranteed a system level uncertainty less than 0.1% FS once.
It took all the measurements knowledge and skill we could get together.
And we could do it only in lab ambient conditions and only at DC.
The three channel load measurement system lived in a velvet lined
box when not in use and was never disconnected. The bill for each
use of the system, including custom calibration, was about $25,000
-- and was worth it.
Some Rays of Hope
DoD flight test laboratories are getting very interested in the
uncertainty of their measurements. At least the flight test centers
at Edwards AFB in California and the Navy’s at Patuxent
River, Maryland are working on this issue. The intent is to eventually
have a standard approach to uncertainty across all government
test facilities. That approach will probably end up in the public
domain. By the way, my sense is that the Europeans are farther
down this road than we are here in the states. If you have direct
knowledge of this, please let me know so I can share the information.
If these issues are of interest to you, my
short course is about the 1, 5, 20% or larger errors you are
making, but don’t
know you are making, how to avoid them by proper system design,
and how to validate your data. This is the stuff they never taught
you in college. Contact Wayne
Tustin here at Equipment Reliability
Institute for course information.
Charles "Chuck" Wright, developer
of the Measurements Engineering Department for a leading satellite
manufacturer, has three decades of direct and successful experience
in the design and operation of advanced multi channel, computer-driven
measurement
systems for test and evaluation. To learn more about Chuck or contact
him visit his
page at ERI.
(back to the top) |
| ******************************* |
| Random
Vibration contains all Forcing Frequencies
and thus excites all resonances
by Wayne Tustin
For many weapon and equipment suppliers to the US
Navy, the 1979 Materiel Command (NAVMAT) document P-9492 “Navy
Manufacturing Screening Program - Decrease Corporate Costs - Increase
Fleet Readiness” was the first they’d heard of random
vibration.
What is random vibration?
Let me commence by saying (to newcomers to vibration testing and
screening) what random vibration is not. Random vibration is
not like the familiar, classical, pure tone,
one-frequency-at-a-time sinusoidal vibration of Figure 1. Note
the time domain (as on
an oscilloscope) trace at top. Note the one-line spectral display
beneath with all vibratory energy at one specific frequency f.
If that vibration were sensed by the multi-reed spectrum analyzer
of Figure 2, one reed would respond strongly.
What is complex vibration?
Vibration that simultaneously exists at two or more frequencies,
as in Figure 3, is often called complex or multi-toned. If the
helicopter of Figure 4 had three blades, the resulting vibration
would resemble Figure 3. With a multi-reed spectrum analyzer
resembling Figure 2, two reeds would respond, at main rotor
vibration frequency and at blade-passing frequency.
Along with basic vibration theory and learning
to measure vibration in the field and in the lab, that’s
about as far as we usually get on Day #1 of a 3-day course.
So what is random vibration?
A new kind of vibration appeared in the 1950’s. Early rockets
failed at ignition or lift-off or flew off-course and had to be
destroyed. This new vibration had none of the regularity of Figures
1 and 3. In theory, at least, random vibration time history never
repeats and, as a result, has a spectrum that is quite wide. Rather
than only one or two analyzer reeds responding, all respond, as
you would see if Figure 5 were one of my video clips.
Do you recall, in high-school physics, how a beam of white light
passing through a prism as in Figure 6 becomes an array of colors,
showing that white light was a mixture of colors, of frequencies?
Shift your thinking, now, from light to mechanics, to broad-spectrum
random vibration. Such
broad-spectrum in-flight vibration creates hardware failures that
never occur with sine or complex
vibrations. Previously-useful
sine vibration testing had little value in detecting weaknesses
that would appear in flight. Random vibration tests had to be
hurriedly developed, in order to identify those weaknesses, so
that they could be remedied.
Conclusion
It is hoped that newcomers to random vibration testing and screening
now feel comfortable in discussing random vibration. Applications
include not only MIL equipment suppliers and users but also office
high-rel equipment suppliers and users. All are finding that
random vibration is useful.
Wayne Tustin, ERI's president, can be reached
by e-mail
or phone (805) 564-1260. Read more about Wayne at ERI's
website.
(back to the top) |
| ******************************* |
Test
Lab Musings (part 6)
by Robert L. Renz
Even
though accelerometers are designed for vibration and shock, they
don’t appreciate being dropped off the side of the shaker
onto the floor. If you drop an accelerometer, check it out before
you use it again for a test. How? One way is to attach the suspect
unit next to the control accelerometer on a bare fixture. If they
don't agree, or if the suspect unit shows high noise levels, it
may be time to repair if or replace that unit. Try it with another
cable first, though.
While
you’re at it, check out all doubtful cables.
They are fairly delicate, and can get noisy very easily.
Accelerometers
don’t last forever – and Murphy’s law says that
they will die just when you need them the most. Put some away as
spares. Keep extra accelerometer
cables on hand.
If
you have ever needed a connector or an adapter for an accelerometer
cable, you know that the connectors are unique, and can be a challenge
to locate. Check out the Microdot Connector Company’s 50-ohm
screw-on coaxial connectors (S-50 series).
Robert
L. Renz of General Dynamics - Advanced Information
Systems at Bloomington, Minnesota.
(back to the top) |
|
|
Fixture course |
|
Steve Brenner recently
conducted a three-day “open” course on vibration and
shock test fixture design, at Pomona, CA. It ended with a visit
to a “fixture factory” - Baughn Engineering at
LaVerne, CA. I thought the course went well, and the critiques
were favorable. I mention the event because the enrollment was
very small, not nearly as large as I expected. May I please hear
from you? Why were you not in the group? Should we try again? When?
Where? Do you need special notification (besides this newsletter,
our web pages, etc.)?
|
| |
| Free
sample of Chapter 1 |
|
If you would like to request a free sample of Chapter 1 - "What
are vibration and shock?", from Wayne's new book "(...)
Random Vibration and Shock Testing", please visit our website.
Fill out the quick form and submit it to us. We will then e-mail
you a PDF file of Chapter 1.
|
| |
| SAVIAC |
Wayne recently attended the 74th
Shock & Vibration Symposium, held this year at Virginia Beach,
VA. Wayne’s contribution was a tutorial on SRS - the
Shock Response Spectrum - and how it fits into shock testing.
Visit the SAVIAC site for details of the 75th Symposium, to meet
at New Orleans, LA October 30th, 2005.
|
| |
| Vibration
and Shock courses coming up |
|
Wayne Tustin will teach short courses in vibration testing, shock
testing, measurement, analysis, calibration, HALT, ESS and HASS
at the following locations:
December
7-9, 2004
Marietta, Georgia
2005 courses
February 23-25, 2005
Las Vegas, Nevada March
14-16, 2005
Huntsville, Alabama
April 19-21, 2005
Middletown, Rhode Island
June 6-9, 2005
Pfinztal (Berghausen), Germany
Perhaps you’d like to have customized training
presented at your facility, for your designers and test specialists. Contact
us. |
| |
| Vibration
and Shock Message Board |
Please, right now, visit this forum. Leave a question. Or a comment.
No question, no difficulty, nothing to say right now? Add it to your “Favorites”
so
you can come back when you DO have a question or a difficulty or
a comment. |
| |
| Announcements |
|
ESTECH 2005
The 51st Annual Technical Meeting and Exhibition, Estech
2005, will meet on
May 1-4, 2005, at the Hyatt Regency Woodfield, in Chicago.
CEEES Conference
"Methods and Benefits of Environmental Testing
and Engineering" will meet in
Germany, on May 11 and 12,
2005.
|
| |
| Dead
Duck |
A
woman brought a very limp duck into a veterinary clinic. As she lay
her pet on the table, the vet pulled out his stethoscope and listened
to the bird's chest.
After a moment or two, the vet shook his head sadly and said, "I'm
so sorry, your Duck Cuddles has passed away."
The distressed owner wailed, "Are you sure?
"
Yes, I am sure. The duck is dead," he replied.
"
How can you be so sure," she protested. "I mean, you haven't
done any testing on him or anything. He might just be in a coma or
something."
The vet rolled his eyes, turned around and left the room, and
returned a
few moments later with a black Labrador Retriever.
As the duck's owner looked on in amazement, the dog stood on his
hind
legs, put his front paws on the examination table and sniffed the
duck from top to bottom. He then looked at the vet with sad eyes
and shook his head.
The vet patted the dog and took it out, and returned a few moments
later with a cat. The cat jumped up on the table and also sniffed
delicately at the bird. The cat sat back on its haunches, shook
its head, meowed softly
and strolled out of the room. The vet looked at the woman and said, "I'm
sorry, but as I said, this is
most definitely, 100% certifiably, a dead duck."
Then the vet turned to his computer terminal, hit a few keys and
produced a bill which he handed to the woman.
The duck's owner, still in shock, took the bill.
"
$150!", she cried, "$150 just to tell me my duck is dead?!!"
The vet shrugged. "I'm sorry. If you'd taken my word for it,
the bill would have been $20, but with the Lab Report and the Cat
Scan it's now $150.00...."
By David McLaughlin of Davco
Weight Scales Inc. |
| |
|
Contact information
|
|
ERI - Equipment Reliability Institute
1520 Santa Rosa Ave.
Santa Barbara - CA - 93109
Tel: (805) 564-1260
Our fax number:
(805) 966-7875
Wayne Tustin tustin@equipment-
reliability.com
Webmaster webmaster@equipment
- reliability.com
Websites
http://www.equipment-
reliability.com
http://www.vibrationand
shock.com
Copyright © 2000-2004 Equipment Reliability Institute.
All rights reserved. |
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